by: Dr. Leo Farhat and Dr. Denis Lacombe; ESA ESTEC; The Netherlands presented by D.Lacombe ABSTRACT More and more space missions are or are willing to use COTS EEE parts in their projects. Several working group in ESA and outside of ESA are trying to define a standardise way to procure such type of part […]
3.1. COTS procurement for space missions Read More »
by Marcel Manofu (1), Radu Voina (2), Cătălin Negrea (1) (1) Continental Automotive Romania (2) Technical University of Cluj-Napoca OUTSTANDING AWARD PAPER BY PCNS ATTENDEES presented by M.Manofu Abstract Miniaturization leads to decreased supply voltages, which combined with higher current consumption of the integrated circuits (ICs) creates the need for more demanding power distribution network
By A. Yializis Ph.D., PolyCharge America Inc., Tucson, Arizona The paper introduces development of NanoLamTM, solid state, polymer monolithic capacitors, comprising 1000s of nano-thick, cross-linked polymer dielectric layers. The NanoLam amorphous polymer dielectrics have an intrinsic breakdown strength >1000V/mm, can withstand temperatures >200°C and have stable capacitance and dissipation factor with temperature and DC bias
1.1. A Disruptive DC-Link Capacitor Technology for Use in Electric Drive Inverters Read More »
Open Discussion with Panelists MLCC manufacturers comments and discussions: Common declarations: Agrees with the tutorial presentation as accurate to reflect the current situation There is no intension from anyone to hide any characteristics related to the MLCC class II high CV parts behaviour, in opposite the aim is to disclose and share all data relevant
Hot Topic Discussion: MLLC DC BIAS & Ageing Issue Read More »
by Tomas Zednicek, EPCI president and author of „High CV MLCC DC/AC Bias Ageing Capacitance Loss Explained” white paper Over the past years, multi-layer ceramic capacitors have undergone significant improvements. The volumetric density has increased several folds. This unfortunately resulted in a big increase in DC and AC bias sensitivity for many parts. In particular,
Hot Topic Tutorial: MLCC DC BIAS & Ageing Issue Read More »
by Paul Svasta, Ciprian Ionescu, Alexandru Vasile, Cristina Marghescu, Bogdan Mihailescu, Andrei Drumea, Norocel Codreanu presented by Paul Svasta, Emeritus Professor; Politehnica University of Bucharest University “Politehnica” of Bucharest, Romania, Center of Technological Electronics and Interconnection Techniques, UPB-CETTI Abstract At the end of the 70s, an electronic passive components manufacturer had used as motto of
Keynote 4: Passive Electronic Components Education in Romania Read More »
by Rüdiger Scheel; VP Automotive, Murata Electronics Europe
Keynote 3: Shortage of Products – Market Mechanisms and How to avoid Fake-Products Read More »
by Stephan Menzel Head of Product Marketing & Technical Engineering eiCap / eiRis; Würth Elektronik
by Ron Demcko AVX Corporation Fellow, USA rated by PCNS attendees as the BEST Keynote presentation Abstract In the past, system power budgets and data/operating speeds were wide and slow respectively. This allowed passive component selection and consideration to occur at the end of the design cycle. Today in the digital world, emerging single chip semiconductors
Keynote 1: Passive Components Keys to Enabling Advanced Future System Designs Read More »
