List of Standards

The following is a list of most common soldering and mounting standards used and referred by passive component manufacturers in their mounting guide specifications:

  • EIA/IPC/JEDEC J-STD-002E – Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
  • JESD22-B102E – Solderability
  • IPC/JEDEC J-STD-020E – Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices
  • IPC/JEDEC J-STD-033C– Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
  • ECIA/IPC/JEDEC J-STD-075 – Classification of Passive and Solid State Devices for Assembly Processes
  • BS CECC 00802 – Harmonized system of quality assessment for electronic components. Guidance document: CECC Standard method for the specification of surface mounting components (SMDs) of assessed quality
  • EN NF 61192 – Workmanship Requirements For Soldered Electronic Assemblies, AFNORM
  • EN 61760-1:2006 – Surface mounting technology – Part 1: Standard method for the specification of surface mounting components (SMDs)
  • IPC/JEDEC-EIA-625 – Requirements For Handling Electrostatic-Discharge-Sensitive (ESDS) Devices
  • IPC-2221 – Generic Standard on Printed Board Design
  • IPC-SM-782 – Surface Mount Design and Land Pattern Standard
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